• RoHS Compliant
• Four Layer PCB with Split Power Plane and Split Ground Plane for noise isolation
• Surface mount (SMD) Components on both top and bottom, through-hole components on top only.
• Total of 216 Components in an area 3.1 by 2.9 inches (78.74 by 73.66 mm)
• Passive SMD components of 0805 or 1206 size
• Designed for automated assembly and wave solder. (Designed to minimize manufacturing cost.)
• Nine numbered revisions in the evolution of the product. (Eight before the version shown.)
• Hand-Optimized routing (no auto router used) to achieve optimal analog performance.

In addition to layout, each version was provided with:

• Creation and maintenance of the Bill of Material (BoM).
• Creation of instructions for hand prototype assembly.
• Hand assembly of several prototypes.
• Loading of Firmware.
• Functional Testing of all analog channels.

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©Copyright 2006 - 2010 Circuitsville Engineering,
revised 03 January 2010